RAPID™ MEM は、微細ピッチや複雑なルーピングを伴うメモリアプリケーションにおいて、高精度なボンディングを実現するよう設計されています。ProAu、ProOverhang、Multi-Stitch Bonding などのレスポンスベースプロセスを搭載し、積層ダイやオーバーハング構造を持つ難易度の高いデバイスに対しても安定したプロセス性能を発揮します。また、リアルタイムのプロセスモニタリングと予測分析を統合することで、最も要求の厳しい生産環境においても、一貫した性能と歩留まりを保証します。
送信完了
この製品に関心をお寄せいただき、ありがとうございます！
ダウンロードリンクを [CorporateEmail] 宛に送信いたしました。
RAPID™ MEM は、先進的なメモリパッケージング向けに特別に設計されており、微細ピッチや複雑なルーピングに対して高精度なボンディングを実現します。
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
