Advanced Solutions with Adaptive Machine Analytics - More than Bonding

As features and functionalities of ICs increases, driving higher I/Os, the trend for flip chip is moving towards pitches less than 100 μm needing higher accuracy flip chip bonding and alternative interconnect solutions. Designed with performance and accuracy in mind, K&S APAMA™ Plus Thermo-Compression Bonding (TCB) solutions provide higher accuracy and lower pitch bonding with market leading throughput.

The APAMA Series offers fully Automated Chip-to-Substrate (C2S) and Chip-to-Wafer (C2W) solutions for Thermo-Compression Bonding (TCB).