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K&S’s wedge bonding solutions deliver dependable, low-temperature ultrasonic connections, ensuring superior reliability for power devices, discrete components, and mission-critical electronics.



BRIEF OVERVIEW

About wedge bonding technology


Wedge bonding is an ultrasonic wire bonding technique that uses a wedge-shaped tool to bond wires into microelectronic and power electronics devices to create an interconnection between the chips and the package. This process is performed at room temperature and uses round aluminum, copper, or gold wires with sizes varying from 25 µm to 500 µm in diameter or rectangular-shaped ribbon wires for higher power density and high-frequency applications. Wedge bonding forms highly reliable interconnections, and due to its versatility and ease of use, it is used in a wide range of applications and devices, including power electronics, battery manufacturing, sensors, and instruments.

Expanded Bond Area
K&S EXPERTISE

Advanced wedge bonding solutions


K&S has developed advanced wedge bonding systems tailored for power and microelectronics applications. Our technology ensures precise control, delivering robust and durable connections that perform reliably in harsh operating conditions. With decades of expertise, K&S continues to set the standard for wedge bonding in industries where robustness and reliability are highly appreciated.

Expanded Bond Area
Expanded Bond Area
Solution Areas

Strategic applications

  • Power semiconductors & industrial power hybrids
    For high-current, high-thermal load devices such as SiC devices.
  • Automotive power modules
    Essential for traction inverters, DC/DC converters, and control modules requiring vibration and temperature resilience.
  • Aerospace & defense electronics
    Used in mission-critical systems that demand mechanical strength and reliability under harsh conditions.
  • Battery manufacturing
    Applied in EV and energy storage systems for tab and large wire interconnects.
Engineered for success

Key benefits

  • Manufacturing flexibility and robust processes
    Rapid production initiation with minimal disruptions, even with evolving product designs.
  • Low-temperature bonding
    Ideal for heat-sensitive components, ensuring their integrity during manufacturing.
  • Proven reliability
    Similar materials in wires and pads ensure unmatched reliability for mission-critical applications.

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