Wedge Bonding Technology

Wedge bonding is an ultrasonic wire bonding technique that uses a wedge-shaped tool to bond wires into microelectronic and power electronics devices to create an interconnection between the chips and the package. This process is performed at room temperature and uses round aluminum, copper, or gold wires with sizes varying from 25 µm to 500 µm in diameter or rectangular-shaped ribbon wires for higher power density and high-frequency applications. Wedge bonding forms highly reliable interconnections, and due to its versatility and ease of use, it is used in a wide range of applications and devices, including power electronics, battery manufacturing, sensors, and instruments.

K&S has developed advanced wedge bonding systems tailored for power and microelectronics applications. Our technology ensures precise control, delivering robust and durable connections that perform reliably in harsh operating conditions. With decades of expertise, K&S continues to set the standard for wedge bonding in industries where robustness and reliability are highly appreciated.