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Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms.
ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED
manufacturers up to 10% capital cost.
The Asterion™ UW ultrasonic welder is engineered with the latest
architecture that includes a torsional ultrasonic system mounted on a highly
reliable and fast direct-drive XYZ motion system.
Discover recent K&S news and stories.
SINGAPORE, April 19, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company"), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, today announced a conference call is scheduled to discuss the Company's second fiscal quarter 2021 financial results, and its business outlook, on Thursday May 6, 2021 at 8:00am EDT.
The Company will issue its second fiscal quarter 2021 financial results on Wednesday May 5, 2021 after market close.
To access the conference call, interested parties may call +1-877-407-8037 or internationally +1-201-689-8037. A live webcast will also be available at investor.kns.com.
A replay will be available from approximately one hour after the completion of the call through May 13th by calling toll-free +1-877-660-6853 or internationally +1-201-612-7415 and using the replay ID number of 13717954. A webcast replay will also be available at investor.kns.com.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa's expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future.
Kulicke and Soffa
Kulicke and Soffa
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