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Assembly Complexity

Rising costs and diminishing benefits of transistor scaling are enhancing the value of Kulicke & Soffa’s long-established semiconductor assembly competencies.

Are you ready to experience the first taste of disruption?

Catch the first teaser here now!

K&S Launches Power™-C the Dedicated Wedge Bonder for Single-Row TO Package

Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms.

K&S Launches ULTRALUX™ Automatic Wire Bonder

ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED
manufacturers up to 10% capital cost.


Discover recent K&S news and stories.

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Kulicke & Soffa Schedules Third Quarter 2022 Conference Call for 8AM EDT, August 4th, 2022 Jul 20, 2022
Kulicke & Soffa Declares Quarterly Dividend of $0.17 Jun 08, 2022


See a list of our upcoming trade show and seminar events around the world.

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Suburban Collection Showplace
Novi, MI, USA
Sep 13 - Sep 15, 2022
Trade Show
Nangang Exhibition Center
Taipei, Taiwan
Sep 14 - Sep 16, 2022
Trade Show
Expo Guadalajara
Guadalajara, Jalisco
Sep 21 - Sep 22, 2022
Trade Show

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K&S general ethical and legal framework for business practices and conduct.

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