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Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms.
ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED
manufacturers up to 10% capital cost.
The Asterion™ UW ultrasonic welder is engineered with the latest
architecture that includes a torsional ultrasonic system mounted on a highly
reliable and fast direct-drive XYZ motion system.
It has been an amazing journey from where we were almost seven decades ago – our founders Frederick W. Kulicke Jr. and Albert Soffa – were just designing and building many different types of equipment before deciding to take the entrepreneurial leap of faith. It wasn’t long before we began creating lasting value within the semiconductor packaging space.
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