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Catch the first teaser here now!

K&S Launches Power™-C the Dedicated Wedge Bonder for Single-Row TO Package

Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms.

K&S Launches ULTRALUX™ Automatic Wire Bonder

ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED
manufacturers up to 10% capital cost.

K&S Launches ASTERION™ UW the Latest Ultrasonic Interconnect Technology Solutions

The Asterion™ UW ultrasonic welder is engineered with the latest
architecture that includes a torsional ultrasonic system mounted on a highly
reliable and fast direct-drive XYZ motion system.


Discover recent K&S news and stories.

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Kulicke & Soffa Launches KNeXt™ - The Next Generation Industry 4.0 Software Platform Jan 04, 2022
Kulicke & Soffa Collaborates with i3 Microsystems with its LITEQ 500A to Develop Solutions for Next-Generation Advanced Microelectronics Packaging Dec 15, 2021
Kulicke & Soffa to Participate in Several Upcoming Conferences Nov 22, 2021


See a list of our upcoming trade show and seminar events around the world.

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San Diego Convention Center,
Jan 25 - Jan 27, 2022
Trade Show
WeKoPa Resort and Conference Center
Fountain Hills, Arizona
Mar 08 - Mar 09, 2022
Trade Show
Nangang Exhibition Center
Apr 27 - Apr 29, 2022
Trade Show

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