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TURNING BOLD IDEAS INTO TRANSFORMATIVE REALITIES

Reinvent Possible


At Kulicke & Soffa


We Reinvent Possible. Pushing beyond today’s limits by harnessing technology, bold innovation, and transformative thinking, we strive to leap beyond incremental progress – delivering pioneering capabilities and breakthrough solutions that redefine semiconductor assembly and packaging, shaping the future of the industry.


Reinvent Possible: Turning Bold Ideas into Transformative Realities

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For customers

Access cutting-edge solutions to enhance performance, efficiency, and scalability of your operational success.

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For partners

Foster a collaborative ecosystem where diverse expertise delivers breakthrough innovation, market adoption and long-term growth.

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For employees

Provide a culture of curiosity, empowerment, and continuous learning to challenge limits and facilitate transformative innovation.

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For investors

Gain global access to process leadership across the broad semiconductor assembly processes.

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Celebrating 75 years of legacy

To our customers, partners, employees, and investors, thank you for being part of our journey and helping shape our legacy.


Here's to 75 years of excellence, and to the next chapter of our journey together.


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NEWS

Our latest updates

IR NEWS RELEASE

Kulicke & Soffa Declares Quarterly Dividend of $0.205
Aug 27, 2026
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IR NEWS RELEASE

Kulicke and Soffa Industries, Inc. Appoints Dr. Raj Talluri as President and CEO
Aug 17, 2026
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IR NEWS RELEASE

Kulicke & Soffa Reports Third Quarter 2026 Results

Aug 5, 2026

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IR NEWS RELEASE

Kulicke & Soffa Schedules Third Quarter 2026 Conference Call for 8:00 AM ET, August 6th, 2026
Jul 22, 2026
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WHAT WE OFFER

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EVENTS

Catch us here

IMAPS
IMAPS
IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content.
SEMICON West
SEMICON West
From AI and advanced packaging to smart manufacturing, sustainability, mobility, MedTech, and workforce development, SEMICON West is where the industry comes together to solve challenges, accelerate innovation, and build strategic partnerships.
EPTC
EPTC
The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.
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