Clip Attach Technology

Clip attach is a packaging technique for power discrete semiconductors that replace traditional wire bonding with solid copper clips soldered directly onto the dies on the lead frame. The process begins by mounting the semiconductor die on the lead frame using solder or epoxy, followed by positioning a pre-formed copper clip over the die to connect the source and drain pads to the lead frame. The assembly then undergoes a solder reflow process—typically in a vacuum to minimize voids—ensuring strong mechanical and electrical integrity. Finally, inspection and testing verify voiding, alignment, and bond strength for reliability. This streamlined approach eliminates multiple wire bonds, reducing complexity, and improving performance for high-current, high-frequency devices.

Our AVALINE™ platform is an integrated clip attach line engineered for high-volume clip attach processes in discrete power devices. Avaline provides a proven clip attach solution with high throughput, high precision, and high yield. Key systems include:

• AVALINE™-D: High-speed dual dispensing for die attach using solder paste; optimized for thin die handling.
• AVALINE™-C: Precision clip placement with theta-axis control and force monitoring for large clip arrays.
• AVALINE™-V: Vacuum reflow with <5% voiding, low-oxygen environment, and active exhaust for reliable solder joints.