2021 New WBC Products Catalog

HCL

New Generation Hub Blades for Silicon Wafer Dicing, Particularly for Discrete, Logic IC & LCD Driver

Vertical Wire Bonding Solution

K&S Proven Solution for SiP and Memory Packages

Large Wire Wedge

Wedge Bond Consumables

Opti

The latest series of Copper wire capillary products

PS Max

K&S New Blades For Package Singulation

Opto PLUS

Enhanced Blades for LED Package Singulation

Ribbon Wedge

Wedge Bond Consumables

VersaCap 3

Improving Capillary Lifespan and Cost-of-Ownership

Cutters, Wire & Ribbon Guides

Wedge Bonding Consumables

TeraCap

Dedicated for advanced memory and logic devices using gold/silver wire

UniPLUS (Hub)

Hub blade solution for quality and long-life cutting on package singulation material

ACS Pro

Copper capillary for high-pin count and fine pitch, BGA, and PBGA

UniPLUS (Hubless)

Hubless blade solution for quality and long-life cutting on package singulation material

ACS Max

Copper capillary for mid-pin count QFP, QFN, PPF, and μPPF lead frames

ACS Lite

Copper capillary for low-pin count applications, such as discrete and power ICs

Quantis QFN

Latest capillary solution for copper wire bonding

VersaCap

Capillary for low-pin count applications such as LED and discrete semiconductors micro-chips

iCap

Latest technology for gold wire bonding

ARCUS

Taking looping performance to the next level

CIC

Fine and ultra-fine pitch 1st bond reliability

Fortus

Taking the lead in 2nd bond performance

SIGMA II

Tailor-made design for sensitive die structure (Low-k, BOAC) applications

CuPRA 3G

Advanced capillary solution for copper wire bonding

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