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Products

Equipment

Wafer Level Packaging (WLP)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps
MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 165,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel
POP (Package-on-Package)
  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement height
  • Easy to exchange linear flux unit

Products

APTURA
The Future Era of Advanced Packaging
ATPremier PLUS
Advanced Technology Wafer Level Bonder

Katalyst
Highest Accuracy, Highest UPH Flip-Chip Performance
APAMA C2S
Chip-to-Substrate Thermo-Compression Bonder
 
Asterion
Enhanced Capability Hybrid Wedge Bonder
 
POWERCOMM
Advanced Wire
Bonder for
Discrete Devices
APAMA C2W
Chip-to-Wafer Thermo-Compression Bonder
 
Asterion PW
Fast, Precise Ultrasonic Pin Welder
Desktop Robot Series
Advanced Dispensing Desktop Robot
POWERNEXX
Leading Edge Cost 
Performance
Bonder
Asterion EV
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
 
GLE / GLLM Series
Accurate, Versatile, Intuitive Precision Dispensing Robot
ULTRALUX
Automatic Wire Bonder -
Utilizing the Latest Technologies and Materials
 
Asterion SV
Heavy-Duty Wedge Bonder for Cylindrical Battery Bonding
RAPID Pro
Automatic Wire Bonder Enabling Industry 4.0 Communication
 
SL / SSL Series
Advanced Micro Dispensing Platform
Power-C Plus
Cost Performance Wedge Bonder for Power Discrete Application
RAPID MEM
Automatic Wire Bonder Enabling Industry 4.0 Communication
PowerFusion
High Performance Wedge Bonder
 
RAPID
Automatic Wire Bonder Enabling Industry 4.0 Communication
XLS Series
Micro Fluid and Advanced
Packaging Technology
ConnX ELITE Opto
High Speed Automatic Wire Bonder
Automated Material Handling Systems
Accelerating to Industry 4.0
with Proven Smart Manufacturing Solutions 
AVALINE
Complete System Solution for Clip Attach

General Inquiries

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