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Products

Equipment

Wafer Level Packaging (WLP)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps
MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 165,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel
POP (Package-on-Package)
  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement height
  • Easy to exchange linear flux unit

Products

APAMA C2S
Chip-to-Substrate Thermo-Compression Bonder
 
Asterion SV
Heavy-Duty Wedge Bonder for Cylindrical Battery Bonding
AVALINE
Desktop Robot Series
Advanced Dispensing Desktop Robot
iStack S+
For High-End Epoxy and Film Die Attach Applications
Katalyst
Highest Accuracy, Highest UPH Flip-Chip Performance
LITEQ 500 System
Lithographic System for Advanced Packaging Applications
 
LUMINEX
Laser-based mini and micro LED mass transfer system
POWERCOMM
Advanced Wire
Bonder for
Discrete Devices
APAMA C2W
Chip-to-Wafer Thermo-Compression Bonder
 
ATPremier PLUS
Advanced Technology Wafer Level Bonder

GLE / GLLM Series
Accurate, Versatile, Intuitive Precision Dispensing Robot
iFlex
Industry's most flexible one-machine concept
 
iStack W+
Solution for Wafer Level Die Attach
 
Power-C
Dedicated Wedge Bonder for Single-Row TO Package
POWERNEXX
Leading Edge Cost 
Performance
Bonder
iX 502 / iX 302
Scalable output of high first pass yield
 
Power-C Plus
Cost Performance Wedge Bonder for Power Discrete Application
SL / SSL Series
Advanced Semiconductor Micro Dispensing Platform
ULTRALUX
Automatic Wire Bonder -
Utilizing the Latest Technologies and Materials
 
Hybrid High Accuracy
A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length
Hybrid SiP
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture.
Model SSD
Advanced LED Encapsulation Machine
RAPID Pro
Automatic Wire Bonder Enabling Industry 4.0 Communication
 
Asterion
Enhanced Capability Hybrid Wedge Bonder
 
Hybrid SiP
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture
RAPID MEM
Automatic Wire Bonder Enabling Industry 4.0 Communication
XLS Series
Micro Fluid and Advanced
Packaging Technology
Asterion EV
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
 
Hybrid FC/DA
The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting
RAPID
Automatic Wire Bonder Enabling Industry 4.0 Communication
PowerFusion
High Performance Wedge Bonder
 
ConnX ELITE Opto
High Speed Automatic Wire Bonder
Automated Material Handling Systems
Accelerating to Industry 4.0
with Proven Smart Manufacturing Solutions 

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