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Products

Equipment

Wafer Level Packaging (WLP)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps
MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 165,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel
POP (Package-on-Package)
  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement height
  • Easy to exchange linear flux unit
Chip-to-Substrate Thermo-Compression Bonder
 
Heavy-Duty Wedge Bonder for Cylindrical Battery Bonding
Highest Accuracy, Highest UPH Flip-Chip Performance
Lithographic System for Advanced Packaging Applications
 
Laser-based mini and micro LED mass transfer system
Chip-to-Wafer Thermo-Compression Bonder
 
Advanced Technology Wafer Level Bonder

Advanced Dispensing Desktop Robot
For High-End Epoxy and Film Die Attach Applications
Dedicated Wedge Bonder for Single-Row TO Package
Advanced Wire
Bonder for
Discrete Devices
Accurate, Versatile, Intuitive Precision Dispensing Robot
Industry's most flexible one-machine concept
 
Solution for Wafer Level Die Attach
 
Cost Performance Wedge Bonder for Power Discrete Application
Leading Edge Cost 
Performance
Bonder
Scalable output of high first pass yield
 
Advanced Micro Dispensing Platform
Automatic Wire Bonder -
Utilizing the Latest Technologies and Materials
 
Enhanced Capability Hybrid Wedge Bonder
 
A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture.
Advanced LED Encapsulation Machine
Automatic Wire Bonder Enabling Industry 4.0 Communication
 
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
 
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture
Automatic Wire Bonder Enabling Industry 4.0 Communication
Micro Fluid and Advanced
Packaging Technology
The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting
High Performance Wedge Bonder
 
Automatic Wire Bonder Enabling Industry 4.0 Communication
High Speed Automatic Wire Bonder
Accelerating to Industry 4.0
with Proven Smart Manufacturing Solutions 

General Inquiries

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