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Equipment

Advanced Packaging (Hybrid)

SMT assembly meets backend Module Manufacturing

With actual placement speeds of up to 140,000 passives per hour and bonding speeds up to 27,000 flip chips per hour and defect rates lower than 1 defect per million, the K&S AP-Hybrid solutions give you the best of both worlds.

Wafer Level Packaging (WLP)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps
MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 140,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel
POP (Package-on-Package)
  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement height
  • Easy to exchange linear flux unit
A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length
The K&S Hybrid is the first hybrid Flip Chip/passive placement machine with the speed and accuracy needed for cost-effective SiP manufacture
The Hybrid combines high-accuracy Flip Chip bonding directly from wafer with ultra-high-speed chip shooting

General Inquiries

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