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Advanced Packaging (Hybrid)

MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB

MCM & SIP/FC BGA/FC-CSP/ FC-Memory/FCOB
  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 140,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel
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