Something

Solutions
- Advanced Display
- Automotive
- Communications
- Consumer
- Data Processing
- Industrial
Products
- Capillaries
- Dicing Blades
- Wedge Bond Consumables
- K&S Care
- Repair, Refurbishment and Spares Program
- Auto Offline Programming
- KNeXt
- MES/NPI
Careers
- Life at K&S
- Grow with K&S
- Job Opportunities
- Internship Programs
Investors
Company
- Overview
- Leadership
ESG
Media
Contact

eServices Login

Wafer Level Packaging (WLP)

Bonding Flip Chips and/or Passives onto wafers or panels
Processing wafers sizes up to 12" and larger
Cam-X and Secs-Gem compatible
Feeding from wafer, waffle pack, tray or tape and reel
Full controlled Placement force for thin Flip Chips or low profile passives
Full traceability
Fine pitch Copper Pillar Bumps

No Product Models

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.