Advanced Packaging (Hybrid)

Wafer Level Packaging (WLP)

Wafer Level Packaging (WLP)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps
No Product Models

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.