Chip-to-Substrate (C2S)
The APAMA Chip-to-Substrate (C2S) offers fully
Automated solution for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).
Cost-of-Ownership Advantage
Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
C2S Features & Benefits:
- Automation
- Control
- Placement Accuracy
- Performance
- Yield Enhancement
- Adaptability
- Cost-of-Ownership Advantage
Enterprise & Consumer Applications
- Network Routers and Switches
- Servers
- High-end PCs and Graphics
- Smartphones and Tablets