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ENGINEER. BUILD. REDEFINE.

Building on the successful iStack™ platform, the the iStack™ Series machines are engineered with new capabilities and enhanced features to meet the challenges and redefine the way of die bonding.

iStack S+

For High-End Epoxy and Film Die Attach Applications

iStack W+

Solution for Wafer Level Die Attach

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ENGINEER. BUILD. REDEFINE.

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