High Performance & High Productivity die attach
The
iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance.
Features & Options
- High Accuracy kit (5 μm)
- Thin Substrate handling kit (< 100 μm)
- Mapping Functions (Substrate / Wafer)
- Wafer / Substrate contamination removal kit
- OHT / AGV kit
- SMEMA kit
- UV (In-Situ / Post-Bond)
- Tool Contamination monitoring kit