Die Attach

iStack S+

High Performance & High Productivity die attach

The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down process, In-Situ UV and bond force detection mechanism, delivering productivity improvement and performance.
Features & Options
  • High Accuracy kit (5 μm)
  • Thin Substrate handling kit (< 100 μm)
  • Mapping Functions (Substrate / Wafer)
  • Wafer / Substrate contamination removal kit
  • OHT / AGV kit
  • SMEMA kit
  • UV (In-Situ / Post-Bond)
  • Tool Contamination monitoring kit

General Inquiries

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