High Performance WAFER LEVEL die attach
With an emerging trend in attaching thinner die and substrates, the
iStack™ W+ offers a solution for wafer level die attach.
Features & Options
- High Accuracy kit (5 μm)
- Mapping Functions (Substrate / Wafer)
- Wafer / Substrate contamination removal kit
- OHT / AGV kit
- UV (In-Situ / Post-Bond)
- Tool Contamination monitoring kit