Die Attach

iStack W+

High Performance WAFER LEVEL die attach

With an emerging trend in attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach.
Features & Options
  • High Accuracy kit (5 μm)
  • Mapping Functions (Substrate / Wafer)
  • Wafer / Substrate contamination removal kit
  • OHT / AGV kit
  • UV (In-Situ / Post-Bond)
  • Tool Contamination monitoring kit

General Inquiries

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