Join THE FUTURE OF ADVANCED PACKAGING
LITEQ 500 is a lithography solution dedicated for Advanced Packaging with a lower cost-of-ownership designed to meet the demands of 2.5/3D, Wafer-level packaging, Fan-in, Fan-out, Flip Chip, and relevant applications such as MEMS, LED, CIS, RF, mobile processor, and CPU/GPU.
Key applications: Redistribution layer, Cu Bumping, Fan-out Wafer level packaging, MEMS
Key Features & Benefits of the LITEQ 500 projection stepper
- Up to 1.2µm resolution for Lines/Spaces
- More than 16µm Usable depth of focus for 2µm (L/S)
- High Throughput & handling wafer sizes from 100 to 300mm
- Multi-product reticle
s masking
- High-warpage wafer handling
- Die-shift or rotation correction on reconstructed wafers
- Die-to-die exposures and overlay measurements
- Contact-free wafer-edge protection or exposure