Wafer Level Bonder

ATPremier PLUS

Advanced Technology Wafer Level Bonder 

The ATPremierPS PLUS™ is another extension of the successful Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier PLUS delivers high productivity with increased efficiency.
Key Features
  • Able to Bond up to 300 mm Diameter Wafers, Ceramics or Substrates
  • Bond Placement Accuracy
    - ±3.5µm @3 sigma (200mm Work Piece)
    - ±5.0µm @3 sigma (300mm Work Piece)
  • Power Series Advanced Hardware and Software Controls
  • Best-in-Class Low Temperature Gold Bumping
  • Improved Serviceability with Easy Access to Lower Console
  • Programmable Power Supply System with Back-Up
  • Upgradeable Capabilities
    - Optional Copper or Silver Alloy Capability and Kits
    - Optional Basic Wire Bonding Capability
  • Smallest Footprint in the Market

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.