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ATP MEM PLUS ATP PLUS ATP LITE

K&S Wafer Level BondERS - Trusted Solution to Make
You Succeed in Wafer Level Packaging

High Throughput and Reliability
Lowest Cost of Ownership (COO)
Largest Install Base
Up to 300mm Wafer Bumping, Wire Bonding, and Vertical Wire Applications
Automation Solutions: Auto Wafer Handler and EFEM

Click here to contact our sales offices in your region!

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Wafer Level Bonder (Complete Portfolio) Request Download

ATPremier MEM PLUS

Enables High i/o and Low Cost Memory Packaging

Redefining Precision and Productivity

The Smart Choice for Cost and Performance

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