Advanced Technology Wafer Level Bonder
The
ATPremierPS PLUS™ is another extension of the successful
Power Series platform. The superior wafer level stud bumping and wire bonding of the ATPremier
PLUS delivers high productivity with increased efficiency.
Key Features
- Able to Bond up to 300 mm Diameter Wafers, Ceramics or Substrates
- Bond Placement Accuracy
- ±3.5µm @3 sigma (200mm Work Piece)
- ±5.0µm @3 sigma (300mm Work Piece)
- Power Series Advanced Hardware and Software Controls
- Best-in-Class Low Temperature Gold Bumping
- Improved Serviceability with Easy Access to Lower Console
- Programmable Power Supply System with Back-Up
- Upgradeable Capabilities
- Optional Copper or Silver Alloy Capability and Kits
- Optional Basic Wire Bonding Capability
- Smallest Footprint in the Market