Wedge Bonder

K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils).
For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support.  Its bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.

Heavy-Duty Wedge Bonder for Cylindrical Battery Bonding
Dedicated Wedge Bonder for Single-Row TO Package
Cost Performance Wedge Bonder for Power Discrete Application
Enhanced Capability Hybrid Wedge Bonder
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
High Performance Wedge Bonder

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.