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Equipment

Wedge Bonder



K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils).
 
For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support.  Its bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.

Enhanced Capability Hybrid Wedge Bonder
 
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
 
High Performance Wedge Bonder
 

General Inquiries

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