DEDICATED WEDGE BONDER FOR SINGLE-ROW TO PACKAGE
Power-C™ Wedge Bonder is built specifically for single-row TO package power devices. These bonders are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms. In addition, expanded pattern recognition capabilities deliver industry leading productivity and reliability.
Key Advantages:
- Horizontal moving anvil
- Improved MTBA with enhanced pattern recognition
- Bond quality control and assessment
- Ease of Use
- Reduced maintenance and proven field performance