Auto OLP™ - Customer software application to run within industry standard AutoCAD® from Autodesk
Build complete bond recipes with the power of AutoCAD®
K&S’ new Auto OLP software operates inside AutoCAD using industry standard design techniques. In minimal time, you can increase the effectiveness of your wire bonders by converting die and package drawings into complex and precise bonder recipes.
Reduced Teach Time
Auto OLP guides operators through the program to ensure that critical process information is entered. Use of original device diagrams in an easy-to-use Windows® PC environment reduces bond program generation time.
Higher Bonder Utilization
Auto OLP operates on your standard PC, remote from the clean room. Your bonders remain fully productive. Programs can be transferred via network, or by portable media.
Increased Teach Accuracy and Capability
K&S' Auto OLP complements with AutoCAD's powerful visual tools in eliminating mis-wiring. Direct use of CAD-generated data reduces Teach error and increases yields.
Greater Process Control
Auto OLP builds complete bonder recipes with pre-approved sets of parameters - limiting the chance of parameter errors by operators.
|CAD Version Supported
||Win 7, Win 8
||Win 7 SP1, Win 8.1 with update KB2919355,
|Win 7 SP1, Win 8.1 with update KB2919355,
||4.6 or 4.7