Software

Auto OLP

Auto OLP™ - Customer software application to run within industry standard AutoCAD® from Autodesk

Build complete bond recipes with the power of AutoCAD®
K&S’ new Auto OLP software operates inside AutoCAD using industry standard design techniques. In minimal time, you can increase the effectiveness of your wire bonders by converting die and package drawings into complex and precise bonder recipes.
 
Reduced Teach Time
Auto OLP guides operators through the program to ensure that critical process information is entered. Use of original device diagrams in an easy-to-use Windows® PC environment reduces bond program generation time.

Higher Bonder Utilization
Auto OLP operates on your standard PC, remote from the clean room. Your bonders remain fully productive. Programs can be transferred via network, or by portable media.

Increased Teach Accuracy and Capability
K&S' Auto OLP complements with AutoCAD's powerful visual tools in eliminating mis-wiring. Direct use of CAD-generated data reduces Teach error and increases yields.
 
Greater Process Control
Auto OLP builds complete bonder recipes with pre-approved sets of parameters - limiting the chance of parameter errors by operators.
 
Platform OLP 2008 OLP 2011 OLP 2013 OLP 2015 OLP 2017
CAD Version Supported

AutoCAD
2007/
2008/
2009

AutoCAD
2010/
2011/
2012
AutoCAD
2013/
2014
AutoCAD
2015/
2016
AutoCAD
2017
OS Support Win 9x ~ Win XP Win 9x ~ Win XP, Win Vista Win 9x ~ Win XP, Win Vista, Win 7 (32/64 bit), Win 8 (V7.0.6 or later) Win 7, Win 8 Win 7 SP1, Win 8.1 with update KB2919355, Win 10
.Net Framework 2.0 3.5 4.0 4.5 4.6

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