The Asterion® TW combines powerful ultrasonics with precise servo positioning to deliver fast and robust welding of thick copper terminals. Together with the Asterion® and Asterion® PW, it forms a complete production solution for power module interconnects.


Powered by 3,500 W of ultrasonic energy and 1,500 N of force, Asterion® PW ensures robust welding of Cu terminals up to 2 mm thick.


The ±180º weld head precisely orients each weld to minimize stress on terminals and surrounding components.


With a high-resolution linear motor positioning system, the welder achieves exceptional ±40 µm weld placement repeatability at 3 σ precision.

High Performance

Utilize latest technology

The Asterion® TW features the latest ultrasonic welding technology with an advanced precision servo positioning system.


  • Provides a robust and stable welding process (terminals to substrates) without heat or hazardous byproducts.

  • 3500 W power and 1500 N force for precise welding of up to 2 mm copper terminals.

Maximum Flexibility

Large motion range

  • 150 mm z-axis stroke easily handles significant height variations in power modules.
  • ±180° theta axis for optimal ultrasonic motion orientation to minimize component stress.
Adaptive Solutions

Optional material handling system

  • Inline and magazine configurations are available to meet diverse production requirements.

  • K&S-designed clamp tooling ensures an optimal and efficient welding process.

  • A robust cleaning station with an ionizer effectively removes particles from the module.

こちらもおすすめ

その他の製品

Asterion®
Asterion®
多目的用途ハイブリッドウェッジボンダー
Asterion® EV
Asterion® EV
拡張されたボンディングエリアを持つウェッジボンダ―
Asterion® SV
Asterion® SV
円筒型バッテリーボンディング用途向けウェッジボンダ―
おすすめ記事

関連コンテンツ

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
クッキー設定

当ウェブサイトでは、より良いサービスをご提供するためにCookie(クッキー)を使用しています。 このメッセージを受け入れることで、クッキーの使用に同意されたものとみなされます。