logo
search menu


The Asterion® TW combines powerful ultrasonics with precise servo positioning to deliver fast and robust welding of thick copper terminals. Together with the Asterion® and Asterion® PW, it forms a complete production solution for power module interconnects.


Powered by 3,500 W of ultrasonic energy and 1,500 N of force, Asterion® TW ensures robust welding of Cu terminals up to 2 mm thick.


The ±180º weld head precisely orients each weld to minimize stress on terminals and surrounding components.


With a high-resolution linear motor positioning system, the welder achieves exceptional ±40 µm weld placement repeatability at 3 σ precision.

High Performance

Utilize latest technology

The Asterion® TW features the latest ultrasonic welding technology with an advanced precision servo positioning system.


  • Provides a robust and stable welding process (terminals to substrates) without heat or hazardous byproducts.

  • 3500 W power and 1500 N force for precise welding of up to 2 mm copper terminals.

Maximum Flexibility

Large motion range

  • 150 mm z-axis stroke easily handles significant height variations in power modules.
  • ±180° theta axis for optimal ultrasonic motion orientation to minimize component stress.
Adaptive Solutions

Optional material handling system

  • Inline and magazine configurations are available to meet diverse production requirements.

  • K&S-designed clamp tooling ensures an optimal and efficient welding process.

  • A robust cleaning station with an ionizer effectively removes particles from the module.

こちらもおすすめ

その他の製品

Asterion®
Asterion®
多目的用途ハイブリッドウェッジボンダー
Asterion® PW
Asterion® PW
新たな効率と精度を実現する次世代の超音波ピン接合装置
おすすめ記事

関連コンテンツ

IMAPS
IMAPS
IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content.
SEMICON West
SEMICON West
From AI and advanced packaging to smart manufacturing, sustainability, mobility, MedTech, and workforce development, SEMICON West is where the industry comes together to solve challenges, accelerate innovation, and build strategic partnerships.
EPTC
EPTC
The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.
クッキー設定

当ウェブサイトでは、より良いサービスをご提供するためにCookie（クッキー）を使用しています。 このメッセージを受け入れることで、クッキーの使用に同意されたものとみなされます。