logo
search menu


The Asterion® TW combines powerful ultrasonics with precise servo positioning to deliver fast and robust welding of thick copper terminals. Together with the Asterion® and Asterion® PW, it forms a complete production solution for power module interconnects.


Powered by 3,500 W of ultrasonic energy and 1,500 N of force, Asterion® PW ensures robust welding of Cu terminals up to 2 mm thick.


The ±180º weld head precisely orients each weld to minimize stress on terminals and surrounding components.


With a high-resolution linear motor positioning system, the welder achieves exceptional ±40 µm weld placement repeatability at 3 σ precision.

High Performance

Utilize latest technology

The Asterion® TW features the latest ultrasonic welding technology with an advanced precision servo positioning system.


  • Provides a robust and stable welding process (terminals to substrates) without heat or hazardous byproducts.

  • 3500 W power and 1500 N force for precise welding of up to 2 mm copper terminals.

Maximum Flexibility

Large motion range

  • 150 mm z-axis stroke easily handles significant height variations in power modules.
  • ±180° theta axis for optimal ultrasonic motion orientation to minimize component stress.
Adaptive Solutions

Optional material handling system

  • Inline and magazine configurations are available to meet diverse production requirements.

  • K&S-designed clamp tooling ensures an optimal and efficient welding process.

  • A robust cleaning station with an ionizer effectively removes particles from the module.

YOU MAY ALSO LIKE

Other products

Asterion®
Asterion®
Hybrid wedge bonder for advanced interconnect applications
Asterion® EV
Asterion® EV
The Asterion® EV expanded platform for a larger bonding area
Asterion® SV
Asterion® SV
The Asterion® SV for cylindrical battery bonding
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.