MEET WITH US
22nd International Conference and Exhibition on Device Packaging (DPC)
Organized by the International Microelectronics Assembly and Packaging Society (IMAPS), DPC serves as a premier forum for knowledge exchange, offering extensive technical, social, and networking opportunities to connect with leading experts in the field.
Date

Mar 02, 2026 - Mar 05, 2026

Booth & Venue

Booth #408
Sheraton Grand at Wild Horse Pass, Phoenix, Arizona, USA

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Tags

Trade Show
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