Something
A

产品

设备

晶圆级封装 (WLP)
  • 焊接和晶圆或基板上的被动晶圆的焊接
  • 可处理的晶圆尺寸可达12英吋及以上
  • Cam-X 和 Secs-Gem 兼容
  • 可从晶圆、华夫盘、盘、tape和reel 上直接抓取
  • 完全控制 Flip Chip 或 low profile passives 的放置力度
  • 完全可追溯
  • 微间距铜柱植球
MCM 和 SIP/FC BGA/FC-CSP/ FC-记忆体/FCOB
  • Flip Chip 焊接速度可达 27,000 cph (IPC)
  • Chip Shooting 速度可达 140,000 cph (IPC)
  • 高质量的抓取和放置工艺
  • 贴片和晶圆级封装精度可达 7 微米
  • 完全控制 Flip Chip 或 low profile passives 的放置力度
  • 可从晶圆、华夫盘、盘、tape和reel 上直接抓取
POP (Package-on-Package)
  • 业界最小的设备占地面积，Die or BGA stacking 产能最高
  • 可从晶圆、华夫盘、盘、tape和reel 上直接抓取
  • 完全控制 Flip Chip 或 low profile passives 的放置力度
  • Linear flux unit 更换简便

产品

APTURA
The Future Era of Advanced Packaging
ATPremier PLUS
先进的晶圆封装焊接机
 
Katalyst
Highest Accuracy, Highest UPH Flip-Chip Performance
APAMA C2S
Chip-to-Substrate Thermo-Compression Bonder

Asterion
Enhanced Capability Hybrid Wedge Bonder
 
ATPremier PLUS
先进的晶圆封装焊接机
 
POWERCOMM
专为分立器件设计的
先进焊线机
APAMA C2W
Chip-to-Wafer Thermo-Compression Bonder

Asterion PW
Fast, Precise Ultrasonic Pin Welder
Desktop Robot Series
Advanced Dispensing Desktop Robot
POWERNEXX
高性价比
焊线机
Asterion EV
Enhanced Capability Hybrid Wedge Bonder (Extended Version)
 
GLE / GLLM Series
Accurate, Versatile, Intuitive Precision Dispensing Robot
ULTRALUX
Automatic Wire Bonder -
Utilizing the Latest Technologies and Materials
 
Asterion SV
Heavy-Duty Wedge Bonder for Cylindrical Battery Bonding
RAPID Pro
自动焊线机
 
SL / SSL Series
Advanced Micro Dispensing Platform
Power-C Plus
Cost Performance Wedge Bonder for Power Discrete Application
RAPID MEM
Automatic Wire Bonder Enabling Industry 4.0 Communication
PowerFusion
High Performance Wedge Bonder
 
RAPID
Automatic Wire Bonder Enabling Industry 4.0 Communication
XLS Series
Micro Fluid and Advanced
Packaging Technology
ConnX ELITE Opto
High Speed Automatic Wire Bonder
Automated Material Handling Systems
Accelerating to Industry 4.0
with Proven Smart Manufacturing Solutions 
AVALINE
Complete System Solution for Clip Attach

联系我们

有什么可以帮您？请联系我们。

问询表
问题吗？ Contact us. 跟随我们 Facebook, Instagram, LinkedIn, 要么 Youtube.
© 2025 - Kulicke & Soffa Industries, Inc.