K&S is pleased to announce that we will be participating in SEMICON CHINA 2021!
Join us at the convention at Booth #3251, Exhibition Hall N3.
Power™-C Wedge Bonder is built specifically for single-row TO package power devices. These bonders
are driven by proven and powerful direct-drive motion systems, bondheads, ultrasonic generator systems
and wire feeding mechanisms, that are on the PowerFusion™ and Asterion™ platforms.
ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED
manufacturers up to 10% capital cost.
The Asterion™ UW ultrasonic welder is engineered with the latest
architecture that includes a torsional ultrasonic system mounted on a highly
reliable and fast direct-drive XYZ motion system.
近70年来，我们的发展历程可谓令人惊叹--- 创始者Frederick W. Kulicke Jr. 和 Albert Soffa从不同设备的设计开始，到在半导体封装业界占领一席之地，短短几年，实现了作坊主到企业家的飞跃。68年中，K&S秉承持续为客户创造价值的信念；未来，我们还将为世界带来更多科技发现和创新！
查阅 K&S 近期新闻和故事
SINGAPORE, March 16, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S" or the "Company") announced today that ongoing investments in development continue to extend the Company's value proposition within served markets. The Company is well positioned to support ongoing growth and business momentum as new product qualifications and order intake remain strong.
5G technology adoption, electrification of the automotive market and a strong demand for consumer electronics are expected to support above average semiconductor growth over the coming years. This strong demand environment, combined with the rapid growth of increasingly complex assembly techniques, continues to drive the Company's strategy of developing high-performance, market-leading semiconductor equipment.
K&S's ULTRALUX™ and RAPID™ series ball bonding systems along with advanced packaging solutions are engineered to create a differentiated interconnect solution for APU, RF module, AIP (antenna-in-package), memory and various SIPs supported by 5G and general semiconductor trends. The Company's POWER-C™ and Asterion™ series of wedge bonding solutions support the increasing demand for high-power devices, intelligent power modules and battery interconnects for electric vehicles.
K&S will be demonstrating the capabilities of the RAPID™ architecture along with the POWER-C™ wedge bonder at the SEMICON China 2021 trade show from March 17 to 19, 2021 in Shanghai.
The POWER-C™ wedge bonder is engineered for single-row TO (transistor outline) package power devices. Its expanded pattern recognition capabilities deliver industry leading productivity and reliability. The POWER-C™ is driven by the same powerful direct-drive motion systems, bondheads, ultrasonic-generator systems and wire-feeding mechanisms, that are included within the proven PowerFusion™ and Asterion™ platforms.
"As the strong growth in the semiconductor and automotive markets continues, we remain committed to providing the industry with best-in-class systems and solutions that address the increasing complexity of semiconductor assembly. Our existing technology portfolio and development roadmaps are well positioned to extend our customers' long-term value propositions," said Chan Pin Chong, K&S's Executive Vice President, Products and Solutions.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor, LED and electronic assembly solutions serving the global automotive, consumer, communications, computing and industrial markets. Founded in 1951, K&S prides itself on establishing foundations for technological advancement - creating pioneering interconnect solutions that enable performance improvements, power efficiency, form-factor reductions and assembly excellence of current and next-generation semiconductor devices.
Leveraging decades of development proficiency and extensive process technology expertise, Kulicke & Soffa's expanding portfolio provides equipment solutions, aftermarket products and services supporting a comprehensive set of interconnect technologies including wire bonding, advanced packaging, lithography, and electronics assembly. Dedicated to empowering technological discovery, always, K&S collaborates with customers and technology partners to push the boundaries of possibility, enabling a smarter future.
Caution Concerning Forward-Looking Statements
In addition to historical statements, this press release contains statements relating to future events, including the future market for our products. These statements are "forward-looking" statements within the meaning of the Private Securities Litigation Reform Act of 1995. While these forward-looking statements represent our judgments and future expectations concerning our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to, the volatile nature of the semiconductor industry, the effects of the COVID-19 pandemic on our business, and the other factors listed or discussed in our Annual Report on Form 10-K for the fiscal year ended October 3, 2020, filed on November 20, 2020, and our other filings with the Securities and Exchange Commission. Kulicke and Soffa Industries, Inc. is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise.
Kulicke & Soffa
Kulicke & Soffa
Investor Relations & Strategic Initiatives
SINGAPORE, March 5, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company"), announced today that its Board of Directors has declared and authorized a quarterly dividend of $0.14 per share of common stock. The dividend payment will be made on April 12, 2021 to holders of record as of March 25, 2021.
Kulicke & Soffa
Kulicke & Soffa
SINGAPORE, March 5, 2021 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa," "K&S" or the "Company") today announced the appointment of Jon A. Olson to its Board of Directors.
Mr. Olson, a seasoned executive with over 40 years of semiconductor industry experience, has provided strategic insight and financial decision making at Intel Corporation and later at Xilinx, Inc. He currently serves as Director on the Board of Xilinx, Inc. and previously Director and Audit Committee Chair of Mellanox Technologies, InvenSense, Inc. and Home Union, Inc.
Mr. Olson has a robust track record of strategic leadership supporting capital allocation, M&A, profitability improvement initiatives and technology partnerships. He most recently served as Chief Financial Officer of Xilinx, Inc., where his responsibilities covered finance, IT, purchasing and facilities from 2005 through his retirement in 2016. Prior to joining Xilinx, Mr. Olson spent over 25 years at Intel Corporation where, as Director of Finance, he was responsible for the finance function of all business units, factories and administrative support company-wide.
Peter Kong, Chairman of the K&S Board of Directors, stated, "We welcome Jon to the K&S Board. His industry experience, financial leadership and strategic accomplishments are significant. We look forward to his contributions as the Company continues to execute on several exciting opportunities."
"K&S is currently in a unique position and has many paths to extend value creation," said Jon Olson. "I am excited to provide guidance on the Company's near- and long-term initiatives to maximize this potential."
Mr. Olson serves as a Member of the Deans Advisory Council and was also inducted to the Academy of Alumni Fellows of the Kelley School of Business, Indiana University. In 2010, he was recognized as CFO of the Year by Silicon Valley Business Journal. Mr. Olson earned his Bachelor of Science in Accounting from Indiana University and his MBA from Santa Clara University.
Kulicke & Soffa
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