ATPremier MEM PLUS™ – enables high i/o and low cost Memory Packaging

The ATPremier MEM PLUS™ is our latest wafer-level packaging solution to meet the demands of today’s memory packaging. Leveraging K&S’ innovative Vertical Wire Technology, it delivers breakthrough performance for next-generation DRAM and NAND assembly.

• Highest Throughput and Lowest CoO
• Latest Response-Based Processes for Memory Applications
• New Advanced Optical System and Inspection Capabilities
• Single Bonder Solution for 8" and 12" Wafer
• Capability to Integrate Auto Wafer Handler or EFEM for Factory Automation