The ATPremier MEM PLUS™ is the latest wafer-level solution to meet the demands of today’s memory packaging. Leveraging K&S’s innovative Vertical Wire Technology, it delivers breakthrough performance for next-generation DRAM and NAND assembly.


ATPremier MEM PLUS™ is built with Advanced Vertical Wire Technology, delivering highest throughput and cost efficiency.



Optimized for next-generation DRAM and NAND, it integrates response-based processes and an optical system for precise alignment of stacked-die devices and high-precision inspection to ensure device quality.

Production Efficiency

Cost-effective production

Highest throughput and lowest COO (Cost of Ownership).

Memory Efficiency

Optimized memory processes

Latest response based processes for memory applications.

Optical Precision

Advanced optics and inspection

Advanced optical system and inspection capabilities.

Expanded Bond Area
Wafer Versatility

Flexible wafer compatibility

Single bonder solution for 8” and 12” wafers.

Automation Ready

Factory automation integration

Capability to integrate Auto Wafer Handler or EFEM for factory automation.

HOW IT WORKS

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