logo
search menu


The ATPremier MEM PLUS™ is the latest wafer-level solution to meet the demands of today’s memory packaging. Leveraging K&S’s innovative Vertical Wire Technology, it delivers breakthrough performance for next-generation DRAM and NAND assembly.


ATPremier MEM PLUS™ is built with Advanced Vertical Wire Technology, delivering highest throughput and cost efficiency.



Optimized for next-generation DRAM and NAND, it integrates response-based processes and an optical system for precise alignment of stacked-die devices and high-precision inspection to ensure device quality.

Production Efficiency

Cost-effective production

Highest throughput and lowest COO (Cost of Ownership).

Memory Efficiency

Optimized memory processes

Latest response based processes for memory applications.

Optical Precision

Advanced optics and inspection

Advanced optical system and inspection capabilities.

Expanded Bond Area
Wafer Versatility

Flexible wafer compatibility

Single bonder solution for 8” and 12” wafers.

Automation Ready

Factory automation integration

Capability to integrate Auto Wafer Handler or EFEM for factory automation.

HOW IT WORKS

Watch video

YOU MAY ALSO LIKE

Other products

ATPremier LITE™
ATPremier LITE™
ATPremier LITE™ offers advanced stud bumping to wafer-level packaging
ATPremier PLUS™
ATPremier PLUS™
Engineered for high-performance wafer-level packaging
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.