ATPremier MEM PLUS™ 是满足当今存储封装需求的最新晶圆级解决方案。凭借K&S创新的垂直焊线技术 (Vertical Wire Technology),为下一代DRAM和NAND封装提供了突破性的性能表现。


ATPremier MEM PLUS™ 先进的垂直焊线技术,带来行业领先的产能与成本效益。



该系统针对下一代 DRAM 与 NAND 进行了优化,集成了 response-based 工艺控制以及先进的光学系统,旨在实现堆叠芯片的精准对位,并通过高精度检测确保元件品质。

生产效率

高性价比生产方案

提供行业领先的高产能与低使用成本

存储效能

优化的存储工艺控制

配备专为存储器应用设计的最新 response-based 工艺控制技术

光学精密性

先进的光学与检测能力

搭载先进的光学系统与高精度检测功能

Expanded Bond Area
晶圆兼容性

灵活的晶圆兼容性

每台 ATPremier MEM PLUS™均适用于8吋和 12吋晶圆

自动化就绪

工厂自动化集成

具备自动晶圆搬运系统或EFEM能力,支持现代化工厂的自动化运作

工作原理

观看视频

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专为高性能晶圆级封装而设计
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