Wedge Bonder

Power-C Plus

COST PERFORMANCE WEDGE BONDER FOR POWER DISCRETE APPLICATION

Power-C™ Plus Wedge Bonder is configured specifically to address single and multi-row power discrete applications. Configured for faster order to delivery cycle, these bonders are built based on proven architecture of Power-C and Power Fusion with direct-drive motion systems, ultrasonic generator systems, wire feeding mechanisms and industrial standard communication protocol option. 
Key Advantages:
  • Supports single and multi-row applications up to 76mm width
  • Bond quality control and assessment with non-destructive pull test and in-line pull-test functions
  • USB microscope camera enabling viewing and recording images
  • Ease of use
  • Reduced maintenance and proven field performance

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