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Power-C™ Plus Wedge Bonder is configured specifically to address single and multi-row power discrete applications.

Configured for faster order to delivery cycle, these bonders are built based on proven architecture of Power-C™ and PowerFusion™ with direct-drive motion systems, ultrasonic generator systems, wire feeding mechanisms and industrial standard communication protocol option.


Power-C™ Plus reduces capital expense for power discrete manufacturers by more than 10% while delivering the highest throughput through advanced closed-loop servo control.



Proven processes ensure optimized bonding and the fastest route to production qualification.

Optimized Efficiency

Cost & productivity

  • Low Cost of Ownership with higher UPH for single-row and multi-row leadframe applications.

  • Configured for faster order to delivery cycle to address power discrete market requirements.

Trusted Performance

Reliability & proven architecture

  • Direct drive motion system with less frequent maintenance. Proven performance with Power-C & Power Fusion architecture.

  • Non-destructive pulltest provides in-situ quality check during production.

  • Infinite non-destructive pulltest for post bond quality inspection.

Streamlined Tools

Operator tools & connectivity

  • Industrial standard communication protocol.

  • USB microscope enabling viewing and recording images.

HOW IT WORKS

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