HPLブレード

一般的なシリコンウェハダイシングの競争力のある代替手段を提供します

高いカット品質を維持し、プリカット時間短縮とCoOを改善

LEDパッケージシンギュレーション用ハブブレード

From AI and advanced packaging to smart manufacturing, sustainability, mobility, MedTech, and workforce development, SEMICON West is where the industry comes together to solve challenges, accelerate innovation, and build strategic partnerships.

The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.