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The HPL Hub Blade series deliver high-performance adaptive wafer dicing with superior cut quality, driven by optimized diamond grits, concentration, and bond design. It offers stronger cutting power, higher feed speeds, and consistent quality across the blade’s life.


The HPL Hub Blade series delivers superior cutting performance, powered by advanced slant-cut control that ensures precision in advanced packaging wafer dicing.



Its enhanced blade-tip shape design maintains consistent Z1 cut quality, while a newly engineered bond type enables higher throughput for demanding SiC dicing applications.

SLANT CUT CONSISTENCY

Advanced slant control technology

The HPL Hub Blades’ advanced slant-cut technology enhances both precision and consistency throughout its life. This ensures dependable performance for the demanding requirements of advanced packaging applications.

TIP MORPHOLOGY

Consistent cut quality

The HPL Hub Blades incorporates deformation-reducing technology that preserves its tip shape, ensuring consistent and reliable results throughout extended usage.

PRECISION · EFFICIENCY · DURABILITY

Maximize throughput for SiC

SiC’s hardness makes it prone to chipping during dicing. The HPL Hub Blades optimized diamond grits, concentration, and bond deliver stronger cutting power at high feed speeds. This ensures reliable cut quality and competitive UPH in demanding SiC applications.

APPLICATIONS FOR HPL & HCL BLADES

Wafer saw solutions

APPLICATIONS FOR OPTO PLUS, PS MAX & UNIPLUS (HUBLESS) BLADES

Package saw solutions

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