RAPID™ MEM は、微細ピッチや複雑なルーピングを伴うメモリアプリケーションにおいて、高精度なボンディングを実現するよう設計されています。ProAu、ProOverhang、Multi-Stitch Bonding などのレスポンスベースプロセスを搭載し、積層ダイやオーバーハング構造を持つ難易度の高いデバイスに対しても安定したプロセス性能を発揮します。また、リアルタイムのプロセスモニタリングと予測分析を統合することで、最も要求の厳しい生産環境においても、一貫した性能と歩留まりを保証します。
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RAPID™ MEM は、先進的なメモリパッケージング向けに特別に設計されており、微細ピッチや複雑なルーピングに対して高精度なボンディングを実現します。
As Southeast Asia and Oceania enters a defining period of digital transformation and sustainable development, a new vision for regional growth is taking shape. The Delta SEAO Future Industry Summit 2026 invites business leaders, policymakers, academics, and industry experts to be part of this important conversation under the theme: “Advancing Regional Infrastructure for AI and Energy Transformation Evolution”.
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Delta SEAO Future Industry Summit
As Southeast Asia and Oceania enters a defining period of digital transformation and sustainable development, a new vision for regional growth is taking shape. The Delta SEAO Future Industry Summit 2026 invites business leaders, policymakers, academics, and industry experts to be part of this important conversation under the theme: “Advancing Regional Infrastructure for AI and Energy Transformation Evolution”.
EPTC
The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
