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The HCL Hub Blades series delivers superior wafer dicing performance with enhanced precision, durability, and production efficiency. Designed for high-speed spindle applications, it offers a universal solution for various wafer types while reducing setup time, improving blade life, and ensuring consistent, high-quality cutting results.


A competitive solution meeting both blade CoO and BCP requirements, this product offers 100% plug-and-play compatibility for Z2 and single-cut general applications, enabling simple conversion from key competitor parts without process disruption.

Precision Dicing

High spindle performance

The HCL Hub Blades delivers exceptional wafer cutting precision with its advanced aluminum hub design optimized for high spindle frequency.

Universal Compatibility

Standardized integration

Developed from extensive experience in wafer dicing, the HCL Hub Blades provide a universal, standardized solution for various wafer types. This includes metalized, back-coated, bumped, and laser-grooved wafers.

Operational Efficiency

Pre-dressed optimization

  • Each HCL Hub Blade is pre-dressed in-house to balance diamond exposure and minimize blade eccentricity, drastically reducing pre-cut and pre-dressing cycles.
  • This optimization not only shortens setup time and evaluation cycles but also maximizes cutting power, delivering measurable cost-of-ownership improvements for high-volume production requirements.

APPLICATIONS FOR HPL & HCL BLADES

Wafer saw solutions

APPLICATIONS FOR OPTO PLUS, PS MAX & UNIPLUS (HUBLESS) BLADES

Package saw solutions

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