logo
search menu


UniPLUS™ Hubless Blade series deliver a step-change in cut quality, precision, and productivity, extending blade life and eliminating the need for process conversion in package singulation.


The hubless design enables zero machine conversion for seamless singulation processes, delivering up to six times longer blade life.


A special slit option enhances cooling efficiency and supports effective debris removal for stable, high-quality cutting performance.

Seamless Integration

Zero conversion

  • The UniPLUS™ Hubless design eliminates the need for machine conversion, allowing direct installation into existing dicer systems.
  • This plug-and-play compatibility reduces downtime, simplifies setup, and enables manufacturers to upgrade to next-generation performance without disrupting current production workflows.
Extended Performance

Optimized longevity

  • Built with a unique nickel bond and precise blade geometry, UniPLUS™ Hubless Blades delivers up to six times longer life than traditional blades.
  • It maintains consistent cut quality and minimal kerf change over extended use, ensuring reliable, cost-efficient operation across high-volume singulation lines.
Thermal Efficiency

Cooling optimization

A specialized slit design improves blade cooling and debris removal, reducing heat accumulation and material stress during prolonged use. This results in longer blade life, consistent kerf quality, and cleaner package surfaces across multiple cutting cycles.

APPLICATIONS FOR HPL & HCL BLADES

Wafer saw solutions

APPLICATIONS FOR OPTO PLUS, PS MAX & UNIPLUS (HUBLESS) BLADES

Package saw solutions

YOU MAY ALSO LIKE

Other products

Opto PLUS
Opto PLUS
Enhanced hub blade for LED package singulation
PS Max
PS Max
Advanced solution to package singulation for quality, precision and COO improvement
Dressing Board
Dressing Board
Boost cut quality while reducing pre-cut time and overall COO
YOU MAY ALSO LIKE

Other content

SEMICON Taiwan
SEMICON Taiwan
SEMICON TAIWAN is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON TAIWAN still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.
SEMICON India
SEMICON India
SEMICON India 2025 is envisioned as a pivotal milestone in India’s ascent as a trusted global partner in the semiconductor supply chain. Organized jointly by ISM and SEMI under the visionary leadership of Hon’ble Prime Minister Shri Narendra Modi, the event convenes a wide spectrum of participants—industry leaders, innovators, academia, government, and start-ups—to catalyze collaboration and advancement across the entire microelectronics ecosystem.
SEMIEXPO Vietnam
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.