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iCap™ features a new iZA material composition and upgraded manufacturing process for greater control over grain properties. Its refined design ensures higher dynamic stability and durability, making it ideal for long-life, high-performance gold wire bonding applications.
Built for sustained performance, iCap™ reduces bonding failures and delivers a lifespan up to four times longer than standard capillaries. This improvement enhances manufacturing uptime, throughput, and reliability across mass production conditions.
Designed to lower overall ownership costs, iCap™ supports bond pad pitches from 40–120 µm and wire diameters between 0.6–1.3 mil. Its durability and work efficiency make it well-suited for demanding production environments focused on life and MTBA performance.
