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iCap™ delivers longer tool life, higher productivity, and lower operating costs in gold wire bonding. Its advanced material design and improved manufacturing process enhance durability and stability, allowing consistent, reliable performance even under demanding mass production conditions.


The iCap delivers four times longer lifespan than standard capillaries under mass production conditions.



Its unique design improves dynamic stability, reduces bonding failures, and enhances MTBA for higher productivity and reliability.

Improved Lifespan

Material advancement

iCap™ features a new iZA material composition and upgraded manufacturing process for greater control over grain properties. Its refined design ensures higher dynamic stability and durability, making it ideal for long-life, high-performance gold wire bonding applications.

Higher Productivity

Process efficiency

Built for sustained performance, iCap™ reduces bonding failures and delivers a lifespan up to four times longer than standard capillaries. This improvement enhances manufacturing uptime, throughput, and reliability across mass production conditions.

Operational Range

Cost optimization

Designed to lower overall ownership costs, iCap™ supports bond pad pitches from 40–120 µm and wire diameters between 0.6–1.3 mil. Its durability and work efficiency make it well-suited for demanding production environments focused on life and MTBA performance.

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