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TeraCap™ delivers exceptional bonding consistency, durability, and efficiency for advanced memory and logic device packaging. Built with high-quality composite ceramics, it ensures stable performance, precise control, and longer tool life. Enabling manufacturers to achieve higher yields.


Delivers excellent bonding and looping consistency for higher yield, superior workability with improved MTBA, and extended durability — achieving more bonds per capillary for greater overall efficiency.

Bonding Consistency

Yield efficiency

TeraCap™ delivers stable, repeatable bonding and looping performance with superior workability and tool life. It ensures higher throughput and consistent yield, making it ideal for high-volume production of advanced devices.

Precision Control

Dimensional stability

  • Built with new iZX high-quality composite ceramics, TeraCap™ offers tighter dimensional control and enhanced structural reliability.
  • Its design supports complex memory device architectures, ensuring accurate and dependable bonding results.
VERSATILE BONDING

Diverse applications

  • Supports bond pad pitches from 40–120 µm and wire diameters from 15–33 µm.
  • It accommodates both gold and silver alloy wires across diverse memory and logic device applications.
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