CuGx is engineered specifically for copper wedge bonding, offering excellent wear resistance. It delivers extended tool life, reducing stoppages and human interference while maintaining consistent looping precision. Demonstrated performance shows minimal wear and deflection even after 100K loops, ensuring stable, reliable bonding quality.


As a dedicated wire guide, CuGx delivers increased wear resistance to counter copper’s abrasive behavior.



Even after 100K loops, the guide shows minimal wear, minimal deflection, and maintains sharp, consistent loop formation—ensuring stable, high-precision bonding performance.

Engineered for Copper

Built for copper wedge bonding application

CuGx is designed with a dedicated wire guide optimized for copper wedge bonding, ensuring reliable performance despite copper’s abrasive nature. Its enhanced wear resistance preserves guide integrity over long production runs. This results in stable looping precision with fewer disruptions on the line.

Built to Endure

Longer life, lower costs

Advanced material construction gives CuGx significantly extended tool life, reducing stoppages and human intervention. By maintaining durability under high-volume looping, it helps manufacturers lower their overall cost of ownership. The tool stays consistent longer, improving bonding reliability at scale.

Designed for reliability

Minimal wear, sharper loops

CuGx maintains minimal wear and minimal deflection even after 100K loops, enabling sharper and more consistent loop shapes. This sustained stability ensures each bond remains accurate throughout extended production. Operators gain reliable looping quality without frequent tool changes.

YOU MAY ALSO LIKE

Other products

Cutter-X
Cutter-X
Dedicated cutter for copper wedge bonding
CuExâ„¢
CuExâ„¢
Dedicated wedge tool for copper wedge bonding
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.