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The Asterion® wedge bonder uses cutting-edge technology, including precise position control, accurate pattern recognition, and a large 300 mm x 300 mm bondable area, to maximize productivity, bond quality, and reliability.


The market-leading solution for bonding aluminum and copper wires and ribbons on power modules, automotive sensors, DBCs, and small cylindrical battery packs.


Featuring a large 300 mm x 300 mm bondable area that supports multiple interconnect types, and delivering exceptional ±3 µm at 3σ bond placement repeatability for unmatched precision and reliability.

Flexible Production

Large-format & multi-material capability

Single platform for multiple interconnect materials and form factors with a large bondable area of 300 mm × 300 mm.

Smart Supervision

Easy to use

  • Customizable user interface displays specific functions and information to suit your needs.

  • Bonded device review displays captured images for review during auto run.

  • Standardized user interface across platforms with Poka Yoke and automated calibration features.

Continuous Validation

Quality assurance

  • Graphical bondhead setup with pattern recognition (GBS PR) provides automated visual feedback during consumables setup.

  • Non-destructive pulltest provides in-situ quality check during production.

  • Bond Process Monitoring (BPM+) monitors each bond to identify those that fail to meet quality standards.

HOW IT WORKS

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