ATPremier PLUS™ – Redefining Precision and Productivity
ATPremier PLUS™ offers unmatched precision and productivity, making it an ideal choice for high-performance wafer-level packaging. It excels in stud bumping and wire bonding with exceptional efficiency and throughput.
Key Features
- Bonding Capability:
- Handles Wafers from 4" to 12”, up to 300 mm Diameter Wafers, Ceramics, or Substrates
- Stud Bumping and Wire Bonding
- Bond Placement Accuracy:
- ±3.5µm @3 Sigma for 200mm Work Piece
- ±5.0µm @3 Sigma for 300mm Work Piece
- Gold Bumping: Best-in-Class Low-Temperature Gold Bumping
- Serviceability: Improved with Easy Access to the Lower Console
- Power Supply: Programmable System with Backup
- Upgradeable:
- Optional Copper or Silver Alloy Capabilities and Kits
- Optional Basic Wire Bonding Capability
- Compact Design: Smallest Footprint in the Market