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Building on the proven Power Series platform, ATPremier PLUS™ delivers wafer-level stud bumping and wire bonding, ensuring superior productivity and enhanced flexibility.


ATPremier PLUS™ is designed for versatility, ensuring consistent device performance and high yield.



The compact, service-friendly architecture offers upgrade paths for copper, silver alloy, and wire bonding, making it fully scalable for future production needs.

Wafer Capacity

Large wafer handling

Able to bond up to 300 mm diameter wafers, ceramics or substrates.

Precision Bonding

High bonding accuracy

Its placement accuracy of ±3.5 µm (200 mm) and ±5.0 µm (300 mm) ensures consistent device performance and high yield.

Thermal Advantage

Low temperature bonding capability

Best-in-class low temperature gold bumping.

Automation Ready

Factory automation integration

Capability to integrate Auto Wafer Handler or EFEM for factory automation.

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