ATPremier PLUS™

ATPremier LITE™ offers advanced stud bumping to wafer-level packaging

Designed for next-generation DRAM and NAND assembly

As Southeast Asia and Oceania enters a defining period of digital transformation and sustainable development, a new vision for regional growth is taking shape. The Delta SEAO Future Industry Summit 2026 invites business leaders, policymakers, academics, and industry experts to be part of this important conversation under the theme: “Advancing Regional Infrastructure for AI and Energy Transformation Evolution”.

The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.

As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.