logo
search menu


The Asterion® EV (Extended Version) wedge bonder utilizes cutting-edge technology, including precise position control, accurate pattern recognition, and an extended 300 mm x 860 mm bondable area, to maximize productivity, bond quality, and reliability.


An extended 300 mm x 860 mm bondable area supports larger format applications, such as cylindrical battery modules or multi-lane handling systems, minimizing floor space and maximizing productivity.



Time-proven K&S large wire, configurable, and high-power bond heads enable robust wire and ribbon bonding, leveraging industry-leading bond process expertise.



The new Tab Bond Head enables ultrasonic spot welding of aluminum and copper tabs without the need for heat, particulates, or complex fixturing.

Bonding Versatility

Large-format flexibility & adaptability

  • Single platform for multiple interconnect materials and form factors with a large bondable area of 300 mm × 860 mm.

  • Supports multiple form factor products on single or multi-lane automation for high volume production lines.

  • Ideal for large format cylindrical battery module bonding.

Smart Supervision

Easy to use

  • Customizable user interface displays specific functions and information to suit your needs.

  • Bonded device review displays captured images for review during auto run.

  • Standardized user interface across platforms with Poka Yoke and automated calibration features.

Continuous Validation

Quality assurance

  • Graphical bondhead setup with pattern recognition (GBS PR) provides automated visual feedback during consumables setup.

  • Non-destructive pulltest provides in-situ quality check during production.

  • Bond Process Monitoring (BPM+) monitors each bond to identify those that fail to meet quality standards.

YOU MAY ALSO LIKE

Other products

Asterion® SV
Asterion® SV
The Asterion® SV for cylindrical battery bonding
YOU MAY ALSO LIKE

Other content

SEMICON Taiwan
SEMICON Taiwan
SEMICON TAIWAN is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON TAIWAN still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.
SEMICON India
SEMICON India
SEMICON India 2025 is envisioned as a pivotal milestone in India’s ascent as a trusted global partner in the semiconductor supply chain. Organized jointly by ISM and SEMI under the visionary leadership of Hon’ble Prime Minister Shri Narendra Modi, the event convenes a wide spectrum of participants—industry leaders, innovators, academia, government, and start-ups—to catalyze collaboration and advancement across the entire microelectronics ecosystem.
SEMIEXPO Vietnam
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.