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The Asterion® EV (Extended Version) wedge bonder utilizes cutting-edge technology, including precise position control, accurate pattern recognition, and an extended 300 mm x 860 mm bondable area, to maximize productivity, bond quality, and reliability.


An extended 300 mm x 860 mm bondable area supports larger format applications, such as cylindrical battery modules or multi-lane handling systems, minimizing floor space and maximizing productivity.



Time-proven K&S large wire, configurable, and high-power bond heads enable robust wire and ribbon bonding, leveraging industry-leading bond process expertise.



The new Tab Bond Head enables ultrasonic spot welding of aluminum and copper tabs without the need for heat, particulates, or complex fixturing.

Bonding Versatility

Large-format flexibility & adaptability

  • Single platform for multiple interconnect materials and form factors with a large bondable area of 300 mm × 860 mm.

  • Supports multiple form factor products on single or multi-lane automation for high volume production lines.

  • Ideal for large format cylindrical battery module bonding.

Smart Supervision

Easy to use

  • Customizable user interface displays specific functions and information to suit your needs.

  • Bonded device review displays captured images for review during auto run.

  • Standardized user interface across platforms with Poka Yoke and automated calibration features.

Continuous Validation

Quality assurance

  • Graphical bondhead setup with pattern recognition (GBS PR) provides automated visual feedback during consumables setup.

  • Non-destructive pulltest provides in-situ quality check during production.

  • Bond Process Monitoring (BPM+) monitors each bond to identify those that fail to meet quality standards.

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