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Single platform for multiple interconnect materials and form factors with a large bondable area of 300 mm × 860 mm.
Supports multiple form factor products on single or multi-lane automation for high volume production lines.
Ideal for large format cylindrical battery module bonding.
Customizable user interface displays specific functions and information to suit your needs.
Bonded device review displays captured images for review during auto run.
Standardized user interface across platforms with Poka Yoke and automated calibration features.
Graphical bondhead setup with pattern recognition (GBS PR) provides automated visual feedback during consumables setup.
Non-destructive pulltest provides in-situ quality check during production.
Bond Process Monitoring (BPM+) monitors each bond to identify those that fail to meet quality standards.
