logo
search menu


The SL series is designed for semiconductor microfluid packaging applications. Ideal for narrow gap filling, fine line dispensing, and micro underfill, these systems deliver precision performance while maintaining a compact machine footprint.


The SL series is a high-performance micro-dispensing platform engineered for semiconductor applications, delivering exceptional accuracy, speed, and reliability.



Proven in high-volume manufacturing at leading OSAT and IDM companies, it offers superior productivity and process consistency.

Dispensing Versatility

Versatile dispensing applicators for precision applications

  • Piezo jet valve for high-speed jetting.
  • Auger valve for precision high viscosity contact dispensing.
  • Deposition pump for < 200 µm dispensing.
  • Solder paste jetting valve.
  • High precision air spray coater.
Ultra Precision

High precision applications

SL series come with a special machine base and gantry engineered to meet the highest repeatability accuracy and position accuracy.

Intelligent Alignment

Advanced dispensing vision software with motion control

K&S advanced dispensing vision software integrates motion control and vision alignment with the following features:


  • Support SECS / GEM and mapping requirements.

  • Close loop flow volume control.

  • Quick process parameters setting.

  • Real time dispensing height measurement and compensation.

  • Fiducial on fly.

APPLICATIONS

Dynamic solutions

HOW IT WORKS

Watch video

YOU MAY ALSO LIKE

Other products

ACELONâ„¢
ACELONâ„¢
ACELONâ„¢ reduces setup time and enhances production consistency
Desktop Robot series
Desktop Robot series
Desktop Robot series is designed to be robust, fast, and accurate
XLS series
XLS series
Developed for high precision microfluid packaging
YOU MAY ALSO LIKE

Other content

SEMICON West
SEMICON West
From AI and advanced packaging to smart manufacturing, sustainability, mobility, MedTech, and workforce development, SEMICON West is where the industry comes together to solve challenges, accelerate innovation, and build strategic partnerships.
EPTC
EPTC
The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.
SEMIEXPO Vietnam
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.