SL 系列专为半导体微流体封装应用而设计。该系统是窄间隙填充 、细线点胶以及微型底部填充的理想选择,在保持紧凑设备占地面积的同时,交付了卓越的精密性能。


SL 系列是专为半导体应用工程化设计的高性能微量点胶平台,交付了卓越的精度、速度与可靠性。



该系列已在领先的 OSAT IDM 的大规模生产中得到验证,交付了卓越的生产力与工艺一致性。

点胶多样性

适用于精密应用的多功能点胶阀

  • 压电喷射阀 (Piezo jet valve) 用于高速喷射点胶
  • 螺杆阀 (Auger valve) 用于精密高粘度接触式点胶
  • 精密涂覆泵 (Deposition pump) 用于 <200 µm 的超微量点胶
  • 锡膏喷射阀
  • 高精度气动喷涂机
极致精度

高精度应用方案

SL 系列配备特制的机身底座与龙门架结构,专为满足最严苛的重复精度与定位精度标准而设计。

智能对位

集成了运动控制的先进点胶视觉软件

K&S 先进的点胶视觉软件高度集成了运动控制与视觉对位功能,具备以下核心特性:


  • 支持 SECS / GEM 通讯协议及映射 (Mapping) 需求

  • 闭环流量控制

  • 快速工艺参数设置

  • 实时点胶高度测量与补偿

  • 飞拍对位功能

工作原理

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