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The APAMA™ PLUS series offers a fully automated solution for Thermo-Compression Bonding (TCB), with modular designs supporting C2S and C2W TCB processes such as TC-NCF, TC-NCP, and TC-CUF.

Recognized as the uncontested value leader, it stands as the OSATs' choice for package-on-package devices.


APAMA™ PLUS series brings bundled process performance features and value benchmarking for its uptime – formulae for productivity.

MAXIMIZING YIELD POTENTIAL

Yield enhancement features

Industry-leading process monitors features to prevent yield loss during production.

TRUSTED BY LEADING OSATS

Reputable solutions

Qualified in major OSATs for TC-CUF, TC-NCF, and TC-NCP processes.

HOW IT WORKS

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