APAMA™ PLUS 系列为热压焊接 (TCB) 提供全自动化解决方案。其模块化设计全面支持 C2S 和 C2W 的 TCB 工艺,如 TC-NCF、TC-NCP 和 TC-CUF。

该系列被公认为无可争议的价值领导者,是全球封测代工厂 (OSAT) 在制造堆叠封装 (PoP) 器件时的首选方案。


APAMA™ PLUS 系列集卓越的工艺性能特征行业标杆级的稼动率于一身, 大幅提升生产力

将良率潜力最大化

良率提升特性

行业领先的工艺监测功能,有效防止生产过程中的良率损失。

深受 领先的 OSAT 信赖

可靠的解决方案

已在各大 OSAT 中通过 TC-CUF、TC-NCF 以及 TC-NCP 工艺的全面验证。

工作原理

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