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The Dressing Board enhances diamond protrusion to deliver higher cut quality while helping reduce overall cost of ownership. By shortening or even eliminating the pre-cut process across silicon, ceramic, PCB, and QFN substrates, it streamlines workflow efficiency. Its adaptable mesh sizes support a wide range of dicing blades, ensuring consistent performance across applications.


Boosts cut quality by enhancing diamond protrusion to achieve better cutting performance. It shortens or eliminates the pre-cut process directly lowering cost of ownership.



With a range of mesh sizes, it adapts to various dicing blades to maintain consistent, high-quality results across applications.

Optimized Diamond Exposure

Sharper performance, instantly

By increasing diamond protrusion, the Dressing Board ensures the blade achieves the required cutting sharpness. This leads to more efficient slicing of tough materials. Users gain consistent, high-quality results from every cut.

Shortens pre-cut process

Optimized for efficiency

The Dressing Board enhances overall cut quality by improving blade readiness and stability. Fewer steps result in faster throughput, reducing both labor and machine time. This directly lowers the cost of ownership across production lines.

Multiple mesh sizes available

Design for broad applications

Reduces or eliminates the need for pre-cutting on silicon, ceramic, PCB, and QFN substrates. Various mesh sizes can be adapted to suit various types of dicing blades.

APPLICATIONS FOR HPL & HCL BLADES

Wafer saw solutions

APPLICATIONS FOR OPTO PLUS, PS MAX & UNIPLUS (HUBLESS) BLADES

Package saw solutions

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