logo
search menu


The Dressing Board enhances diamond protrusion to deliver higher cut quality while helping reduce overall cost of ownership. By shortening or even eliminating the pre-cut process across silicon, ceramic, PCB, and QFN substrates, it streamlines workflow efficiency. Its adaptable mesh sizes support a wide range of dicing blades, ensuring consistent performance across applications.


Boosts cut quality by enhancing diamond protrusion to achieve better cutting performance. It shortens or eliminates the pre-cut process directly lowering cost of ownership.



With a range of mesh sizes, it adapts to various dicing blades to maintain consistent, high-quality results across applications.

Optimized Diamond Exposure

Sharper performance, instantly

By increasing diamond protrusion, the Dressing Board ensures the blade achieves the required cutting sharpness. This leads to more efficient slicing of tough materials. Users gain consistent, high-quality results from every cut.

Shortens pre-cut process

Optimized for efficiency

The Dressing Board enhances overall cut quality by improving blade readiness and stability. Fewer steps result in faster throughput, reducing both labor and machine time. This directly lowers the cost of ownership across production lines.

Multiple mesh sizes available

Design for broad applications

Reduces or eliminates the need for pre-cutting on silicon, ceramic, PCB, and QFN substrates. Various mesh sizes can be adapted to suit various types of dicing blades.

APPLICATIONS FOR HPL & HCL BLADES

Wafer saw solutions

APPLICATIONS FOR OPTO PLUS, PS MAX & UNIPLUS (HUBLESS) BLADES

Package saw solutions

YOU MAY ALSO LIKE

Other products

HCL
HCL
Offers a competitive alternative for general silicon wafer dicing
HPL
HPL
Adaptive high-performance blades for advanced wafer dicing
Opto PLUS
Opto PLUS
Enhanced hub blade for LED package singulation
YOU MAY ALSO LIKE

Other content

Delta SEAO Future Industry Summit
Delta SEAO Future Industry Summit
As Southeast Asia and Oceania enters a defining period of digital transformation and sustainable development, a new vision for regional growth is taking shape. The Delta SEAO Future Industry Summit 2026 invites business leaders, policymakers, academics, and industry experts to be part of this important conversation under the theme: “Advancing Regional Infrastructure for AI and Energy Transformation Evolution”.
EPTC
EPTC
The 28th IEEE Electronics Packaging Technology Conference (EPTC 2026), the IEEE EPS flagship event in the Asia-Pacific region, invites original abstracts showcasing cutting-edge research and innovations in electronics packaging.
SEMIEXPO Vietnam
SEMIEXPO Vietnam
As the global semiconductor landscape continues to evolve, Vietnam is positioning itself for a promising future in the semiconductor industry. SEMIEXPO Vietnam will be a pivotal event, exploring opportunities for businesses across the semiconductor value chain, from assembly and testing to fabless/design. This premier event will highlight how local players can elevate Vietnam’s position in the global semiconductor supply chain.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.