logo
search menu


ACS Lite™ is designed for low-pin count power and discrete IC applications with large wire diameters. Featuring the new ACS advanced material, it delivers excellent bondability and consistent performance, reducing overall cost of ownership.


Engineered for efficiency and reliability, this solution delivers competitive cost-of-ownership while enhancing workability and response consistency in large wire bonding applications.



Its advanced material design ensures enhanced wear resistance, maintaining stable performance even under demanding process conditions.

Wide Range

Application flexibility

  • ACS Lite™ supports low-pin count applications such as discrete and power IC devices using large wire diameters.
  • It accommodates bond pad pitches of ≥120 μm, copper wire diameters up to 2.5 mil, and various wire types across lead frame, Power IC, and LED carrier families.
Consistent Performance

Durable design

  • Enhances workability and response consistency during large-wire bonding.
  • Its improved wear resistance ensures predictable tool life and stable long-term performance.
Operational Efficiency

Cost advantage

ACS Lite™ improves productivity through enhanced workability and superior material durability. Manufacturers achieve higher process uptime and a lower total cost of ownership.

YOU MAY ALSO LIKE

Other products

Quantis™ QFN
Quantis™ QFN
Built to overcome complex process challenges on QFN carriers
OPTi series
OPTi series
Serving a wide range of applications across the IC packaging industry
Quantis™ PLUS
Quantis™ PLUS
Copper wire bonding with improved durability and productivity
YOU MAY ALSO LIKE

Other content

SEMICON China
SEMICON China
Discover the next generation of advanced packaging and electronics assembly solutions.
SEMICON SEA
SEMICON SEA
SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products, and brings in the most up-to-date market and technology trends.
ECTC
ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society.
Cookie Settings

We use cookies to provide you the best experience on our website. By accepting this message, you agree to our use of cookies.